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POTTINGA PCB Assembly subjected to extremes of heat and cold, vibration, chemical solutions or high moisture levels may be best protected by potting it in one of a number of different potting formulations available. In general, these forumulations may be broken down into two classes: Hard Epoxies or Semi-Flexible Polyurethanes. Hard Epoxies are generally suitable for through hole assemblies where the complication of an enclosure is undesirable, where certain geometric constraints may be applied, or where particular molded in features such as mounting feet, studs, etc. may be applicable. This material is less suitable for SMT assemblies where many formulations may intrude beneath components and cause mechanical failures. Semi-Flexible Polyurethanes are best suited to SMT Assemblies where their semi-rigidity protectgs the delicate components, draws heat away, and does not apply undesirable strains to the components themselves. A potting box is generally required to define the final shape and retain the material during curing. Action Controls has the experience and the tools to pot a short run manually or a larger run using automatic equipment. |
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